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A Data Plane Security Model Of Segmented Routing Based On Sdp Trust Enhancement Architecture
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By Zihao Mo 1, †, Fangcheng Wang 1, †, Jinhui Li 1, * , Qiang Liu 1, Guoping Zhang 1, * , Weimin Li 2, * , Chunlei Yang 2 and Rong Sun 1
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Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
Photonic Center of Information Materials and Energy, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
Received: February 21, 2023 / Revised: March 25, 2023 / Accepted: March 30, 2023 / Published: March 31, 2023
Temporary link/disconnect (TBDB) technologies have greatly contributed to the construction of reliable thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field also places stricter requirements on TBDB technologies. Here, we review recent advances in temporary bonding materials and various bond removal technologies over the past decade. Several common debonding techniques have been described, including thermal slide, wet chemical dissolution, mechanical dissection, and laser ablation. We review the status quo of different separation technologies and highlight applications of TBDB technology in modern electronic packaging. Possible solutions to the challenges and opportunities faced by different TBDB technologies are proposed. Finally, we try to give a glimpse of their future development and possible applications. We believe that the simple diagrams and fine-tuned data presented in this review will provide readers with an in-depth understanding of TBDB technologies and their broad application scenarios in electrical packaging. future advanced death.
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In recent years, with the rapid development of 5G, artificial intelligence, Internet of Things, automatic control and big data, electronic devices are developing towards miniaturization and multi-function. To achieve high electronic performance, advanced encapsulation technologies such as on-wafer packaging (FOWLP) [1, 2], 2.5D interlayer and 3D encapsulation (e.g. through silicon through, package on package, microelectromechanical systems ) were developed [3, 4, 5, 6, 7, 8, 9, 10]. During 3D chip assembly, a series of polymer-based adhesives typically bond the device wafer to the carrier wafer, which is insensitive to the surface flatness and cleanliness of the device wafer. Because of their simplicity, durability and low cost, adhesives are widely used throughout the manufacturing of microelectronics and microelectromechanical systems (MEMS). These binders include polymers such as epoxy, dry film, benzocyclobutene (BCB), polyimides, and UV-curable compounds [11, 12, 13, 14, 15]. They have the advantage of relatively low temperatures and can protect sensitive parts. In addition, they can be divided into permanent adhesive bonding and temporary adhesive bonding depending on whether the plates separate after bonding . A comparison between bonding and temporary bonding parameters is shown in Table 1. Unlike temporary bonding, adhesives used for permanent bonding usually need to have a low dielectric constant, low conductivity, and low conductivity. Low water absorption, high bond strength and high stability. Permanent bonding technology reduces area and greatly improves product characteristics. Permanent junction technology is mainly used in semiconductor devices such as radio frequency (RF), MEMS, light emitting diodes (LED), time of flight (ToF) devices and especially in sensors. new variables such as complementary metal oxide semiconductors (CMOS) [17, 18, 19].
Unlike the permanent bonding process, the temporary bonding process was originally developed to hold and protect ultrathin semiconductor wafers. Because thicker wafers are difficult to meet the heat dissipation and packaging requirements of high-end chips, the semiconductor industry often requires thinning the wafers to the desired thickness. However, when the wafer thickness falls below 200 μm, the ultrathin wafers become brittle and easily deformed . As a result, the semiconductor industry has proposed a variety of temporary bind/disconnect (TBDB) technologies, where thin wafers of a device are temporarily bonded to thicker solid supports using suitable adhesive . Figure 1 shows an overview of the different TBDB technologies for advanced encapsulation. After the wafers of these devices have been thinned and the back-end fabrication is complete, the media and adhesive must be removed without destruction. Therefore, it is very important to develop different binders and related separation processes that meet the requirements of TBDB technology. A suitable temporary material must provide sufficient adhesion to the sheet during thinning. Furthermore, it must be resistant to acids and alkalis and high temperatures to remain stable during backing processes such as curing, grinding, etching, metallization, etc., before bond removal.
Over the past 20 years, temporary bonding materials have been continuously updated and improved. Liquid wax was originally developed by Nikka Seiko for temporary bonding. Inorganic materials (a-Si:H, etc.) and polymers (polyimide, polyetheretherketone (PEEK), polydimethylsiloxane (PDMS) etc.) , 25, 26]. In addition, the key difference between these temporary bonding materials is that an appropriate debonding method must be developed to accommodate the non-destructive debonding of ultrathin wafers. In addition, the development of modern temporary bonding materials and bond removal processes have
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